Unlocked 5G-NR modem offers seamless access to 4G/5G networks. 5G priority design with 4×4 MIMO high-gain antennas.
NEW
SKU: EZR26-A520 | |
5G-NR modem max 3.4Gbps | |
3000Mbps WiFi6 hotspots | |
Dual nano SIM card slots | |
1xWAN 3xLAN 1x2.5G Ports |
NEW
SKU: EZR26-E520 | |
5G-NR modem max 3.4Gbps | |
3000Mbps WiFi6 hotspots | |
Dual nano SIM card slots | |
1xWAN 3xLAN 1x2.5G Ports |
NEW
SKU: EZR26-D520 | |
5G-NR modem max 3.4Gbps | |
3000Mbps WiFi6 hotspots | |
Dual nano SIM card slots | |
1xWAN 3xLAN 1x2.5G Ports |
NEW
SKU: EZR26-U520 | |
5G-NR modem max 3.4Gbps | |
3000Mbps WiFi6 hotspots | |
Dual nano SIM card slots | |
1xWAN 3xLAN 1x2.5G Ports |
NEW
SKU: EZR26-5G | |
5G-NR modem max 3.4Gbps | |
Wi-Fi 6 hotspot 3000 Mbps | |
Dual Nano SIM card slots | |
1xWAN 3xLAN 1x2.5G Ports |
EZR26-5G Router Development Timeline
Committed to developing a high-performance 5G WiFi 6 router, we spent several months redesigning a brand-new router from the ground up. The motherboard and enclosure went through 4–5 adjustments and iterations. The firmware was tested and updated through more than 20 beta versions before reaching the stable release.
Here is a brief introduction to the development roadmap. The EZR26-5G router utilizes over 17 BOM materials, and the roadmap includes the most critical and challenging components, such as the motherboard, firmware, enclosure, indicators, and more.
Selection and Prototype Building
Evaluating router SoC and RF chipsets since mid-2024, focusing on adequate thread support to ensure high speed and low latency. Then, design the first prototype with the MT7981+MT7976 chipset and integrate drivers to test 5G speed and network performance.
The high-performance SoC, WiFi 6 chip, and 5G modem are power-hungry components that produce considerable heat. So, we deployed a new enclosure from an extrusion aluminum enclosure with CNC machining. It includes a low-maintenance passive cooling system to maintain reliable performance and prevent throttling, even during demanding tasks.
Multiple Proofing and Production
By the end of 2024, numerous reviews, tests, and adjustments have been conducted on the enclosure, motherboard, and indicators to ensure the assemble precision. The PCB layout has been optimized based on RF performance and enclosure compatibility. Stress tests have been performed on power circuits, capacitors, and antennas.
Meanwhile, continuously debug and optimize the firmware system through multiple beta versions, focusing on modem connectivity, wireless stability, and 2.5GHz LAN connections. The stable version has been released by early 2025 with 5G optimization and advanced mobile protocol at the best performance.